Biography
I am a Postdoctoral Researcher at the Department of Computer Science and Engineering, The Chinese University of Hong Kong (CUHK), working with Prof. Tsung-Yi Ho since 2025. Previously, I received my Ph.D. from Southeast University (SEU) in 2024.
My research focuses on Electronic Design Automation (EDA) for advanced technology nodes, with an emphasis on the 3D IC — BSPDN — DTCO co-design methodology. I develop physical design automation techniques for 3D integrated circuits, back-side power delivery networks (BSPDN), and design-technology co-optimization (DTCO) to address the interconnect, power, and thermal challenges in next-generation chip design.
Education
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Postdoctoral Fellow2025 – Present
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M.S. & Ph.D., Electronic Science and Technology2018 – 2024
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Bachelor of Science, Information and Control Engineering2014 – 2018
Research Interests
Advanced Technology Nodes
3D IC
BSPDN
DTCO
Physical Design Automation
Publications
2026
C19
RTL-3D: Timing-aware Tier Partitioning for 3D ICs Using Pre-synthesis Timing Analysis,
ACM/IEEE Design Automation Conference (DAC), Long Beach, Jul. 26–29, 2026
C18
FlexiCTS: CPPR-Aware 3D Clock Tree Synthesis for Face-to-Face Bonded ICs,
ACM/IEEE Design Automation Conference (DAC), Long Beach, Jul. 26–29, 2026
C17
BSPDN-Elite: A Comprehensive Framework for Optimizing Timing, Power and Routing Resources in BSPDN Designs,
ACM/IEEE Design Automation Conference (DAC), Long Beach, Jul. 26–29, 2026
C16
BLADE: Bi-Level Bayesian Optimization for Metal-Density-Constrained Multi-Layer Package Power/Ground Plane Synthesis,
ACM/IEEE Design Automation Conference (DAC), Long Beach, Jul. 26–29, 2026
C15
DiffDEG: Diffusion-Enhanced Design Evolution Graph Representation Learning for Post-Layout Optimization,
ACM/IEEE Design Automation Conference (DAC), Long Beach, Jul. 26–29, 2026
C14
Mixed-structure Double-sided Redistribution Layer Routing for Glass Interposer-based 5.5D ICs,
ACM/IEEE Design Automation Conference (DAC), Long Beach, Jul. 26–29, 2026
C13
TP-GR: An Efficient Global Router for Timing and Power Co-optimization,
Best Paper
ACM International Symposium on Physical Design (ISPD), pp. 1-6, 2026
C12
IDDA-3D: Inter-Die Delay Aware Timing-Driven Placement on Face-to-Face bonded 3D ICs,
ACM International Symposium on Physical Design (ISPD), pp. 1-6, 2026
C11
Partitioning-free 3D-IC Floorplanning,
Asia and South Pacific Design Automation Conference (ASPDAC), pp. 1-6, 2026
2025
C10
ChronoTE: Crosstalk-Aware Timing Estimation for Routing Optimization via Edge-Enhanced GNNs,
IEEE/ACM International Conference on Computer-Aided Design (ICCAD), pp. 1-9, 2025
2024
C9
FACT: Fast and Accurate Multi-Corner Predictor for Timing Closure in Commercial EDA Flows,
ACM/IEEE International Symposium on Machine Learning for CAD (MLCAD), pp. 1-7, 2024
C8
LVF2: A Statistical Timing Model Based on Gaussian Mixture for Yield Estimation and Speed Binning,
ACM/IEEE Design Automation Conference (DAC), pp. 1-6, 2024
C7
A Deep-Learning-Based Statistical Timing Prediction Method for Sub-16nm Technologies,
Design, Automation & Test in Europe Conference (DATE), pp. 1-6, 2024
2023
C6
An Accurate Statistical Cell Delay Model Considering Multiple-Input Switching Effect,
International Symposium of Electronics Design Automation (ISEDA), pp. 375-378, 2023
C5
A Novel Delay Calibration Method Considering Interaction Between Cells and Wires,
Design, Automation & Test in Europe Conference (DATE), pp. 1-6, 2023
2022
J3
A Statistical Cell Delay Model for Estimating the 3σ Delay by Matching Kurtosis,
IEEE Transactions on Circuits and Systems II: Express Briefs, pp. 2932-2936, 2022
C4
A Quantile-Based SUM/MAX Operating Method for Statistical Timing Analysis,
IEEE International Conference on Solid-State & Integrated Circuit Technology (ICSICT), pp. 1-4, 2022
2021
J2
A Fast Cross-Layer Dynamic Power Estimation Method by Tracking Cycle-Accurate Activity Factors with Spark Streaming,
IEEE Transactions on Very Large Scale Integration (VLSI) Systems, pp. 353-364, 2021
2020
J1
VASTA: A Wide Voltage Statistical Timing Analysis Tool Based on Variation-Aware Cell Delay Models,
IEEE Access, vol. 8, pp. 197194-197202, 2020
C3
A Cross-Layer Power and Timing Evaluation Method for Wide Voltage Scaling,
ACM/IEEE Design Automation Conference (DAC), pp. 1-6, 2020
2019
C2
A Fast Reduction Method for Path Process Variations Without Time-Consuming Training,
IEEE International Conference on ASIC (ASICON), pp. 1-4, 2019
C1
A Precise Block-Based Statistical Timing Analysis with Max Approximation Using Multivariate Adaptive Regression Splines,
IEEE International Conference on ASIC (ASICON), pp. 1-4, 2019
Honors & Awards
- Best Paper Award at ISPD 2026: TP-GR — An Efficient Global Router for Timing and Power Co-optimization
- Huawei Hong Kong Young Scholar Funding, 2025–2026
- Second Place at ISPD 2025 with Performance-Driven Large Scale Global Routing Contest
- Qilin Cup (1/307), EDA Elite Challenge, 2020